82C251 DATASHEET PDF

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CAN transceiver for 24 V systems. The device provides differential transmit capability to the bus and differential receive.

I 3 supply current. V 6,7 recessive datasehet voltage. V 7 CANH output voltage.

PDF 82C251 Datasheet ( Hoja de datos )

V 6 CANL output voltage. I sc7 short-circuit CANH current. I sc6 short-circuit CANL current. All information provided in this document is subject to legal disclaimers. Soldering of SMD packages. This text provides a very brief insight into a complex technology.

A more in-depth account. Soldering is one of the most common methods through which packages are attached to.

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82C datasheet & applicatoin notes – Datasheet Archive

The soldered joint provides both. There is no single soldering method that is. Wave soldering is often preferred when through-hole and.

Reflow soldering is ideal for the small pitches and high. Wave soldering is a joining technology in which the joints are made by solder coming from. The wave soldering process is suitable for the following: Not all SMDs can be wave soldered. Packages with solder balls, and some leadless.

82C Datasheet catalog

The reflow soldering process involves applying solder paste to a board, followed by. Key characteristics in both wave and reflow soldering are: Key characteristics in wave soldering are: The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.

Quick reference data Table 1. Thermal characteristics Table 7.

Soldering of SMD packages This text provides a very brief insight into a complex datasheer. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices SMDs are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs.

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82C251 Datasheet PDF

Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile.

Leaded packages, packages with solder datashee, and leadless packages are all reflow solderable.