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Common Mode Rejection Ratio. Propagation delays are matched to simplify use at high frequencies. Output Source Current 44 45 46 5. The dynamic electrical characteristics are defined in Figures 3 through 5. Undervoltage lockout for all channels.
IR (IRF) PDF技术资料下载 IR 供应信息 IC Datasheet 数据表 (1/26 页)
Common Mode Rejection Ratio Op. V S1,2,3 – 0. Voltage Offset Supply Leakage Current? Temperature Figure Supply Voltage Figure 12C. For proper operation the device should be used within the.
Please refer to the Design Tip DT for more details. Refer to Lead Assignments for correct pin configuration. Output Source Current vs. Power Supply Rejection Ratio 40 41 42 43 — — 60 55 — — 80 75 30 4. Operational Amplifier Output Low Short. Datasgeet Thermal Resistance and Power Dissipation ratings are measured. Operational Amplifer Input Offset Voltage. Operational Amplifier Inverting Input Voltage.
Lead Temperature Soldering, 10 seconds. Operational Amplifier Common Mode Figure The IR is a high voltage, high speed power.
CA- Input Current vs. VBS Supply Current vs. Input for over-current shutdown. VBS Undervoltage – vs. For proper operation the device should be used within the recommended conditions. Units Test Conditions 38 39 40 41 42 43 44 45 46 47 48 49 — — 60 55 5. Operational Amplifier Inverting Input Voltage. Turn-Off Fall Time vs. Temperature 18 20 80 Typ. Logic “0” Input Current vs. For proper operation the device should be used within the. CA- Input Current vs.
Temperature Figure 44B. Logic “1” Input Current vs. Temperature Figure 31B. A Max. V BS Undervoltage – vs.
Propagation delays are matched to simplify use at high frequencies. Lead Temperature Soldering, 10 seconds. Symbol Definition Figure Min. For proper operation the device should be used within the. Amplifier High Level Output vs. VCC Undervoltage – vs. Amplifier Slew Rate – vs. Operational Amplifier Power Supply. Power Supply Rejection Ratio Op. Amplifier High Level Output vs.
Logic inputs for low side gate driver output LO1,2,3out of phase.